GOWENIC CPU Thermal Paste, High Thermal Conductivity, Non Conductive, Safe Application, for Standard Power Supplies, Household Appliances, and Entry Level CPUs (MX -4 20g)

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CPU Thermal Paste: This thermal paste features a thermally conductive powder as the core filler, combined with a silicone oil base, ensuring efficient heat transfer while maintaining cost effectiveness, making it an ideal choice for entry level cooling solutions.
Heat Sink Compound: The classic formulation of this heat sink compound ensures mature production and strong compatibility, suitable for most low to medium power electronic components such as standard power supplies, household appliances, and entry level CPUs.
Safe Application: With a silicone oil base, this thermal paste offers excellent fluidity and spreadability, allowing for easy and even application between chips and heat sinks to fill microscopic gaps effectively.
Non Conductive: This thermal grease uses non conductive thermally conductive powders like aluminum oxide and zinc oxide, ensuring it is entirely non conductive to prevent short circuits and protect electronic components.
High Thermal Conductivity: The stable formulation of this thermal paste resists separation and drying under normal usage conditions, maintaining consistent thermal conductivity over extended periods and reducing the need for frequent maintenance.