TF7 CPU Thermal Paste 2g, 12.8W/mK Thermal Compound

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TF7 CPU Thermal Conductivity（W/m.k）：12.8W/m.k,Content：2g
Thermal Paste does not contain any metal particles, oil-free solvents, non conductive, non corrosive, harmless, It is friendly to CPU and GPU and will not damage electronic components
The available temperature is -150℃/ +250℃, thermal resistance < 0.01, density is 2.8 (25℃). Even in high or low temperature environment, its cooling advantage will not be affected
Thermally conductive silicone grease makes it possible to maintain thermal conductivity for a long time on CPUs, GPUs, heat sink modules, chipsets, sensors and other electronic components
[Easy to apply] The needle-type designs is convenient for application and storage. The cream design is dry and hard, better heat conduction, with a spatula for easy application