Dowsil TC-5888 Thermally Conductive Compound 1kg Thermal Paste Silicone Grease Gray for Computer Cooling MPU CPU GPU PCB Assembly Electrical Device Thixotropic Non Curing

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DOWSIL TC-5888 Thermally Conductive Compound, 1kg one Bucket. Thermal Paste Silicone Grease. Computer & Electrical Device Cooling. Thixotropic, Non-Curing. Gray.
Color: Gray. One Part Material: Non-curing. Viscosity At Low Strain Rate: 1,200 Pa·s. Viscosity At High Strain Rate: 100 Pa·s. Specific Gravity: 2.6. Volatile Content, 48 hours at 125°C: 0.02 %. Thermal Conductivity: 5.2 W/mK. Thermal Resistance at 25 N/cm²: 0.05 °C·cm²/W. Bond Line Thickness at 25 N/cm²: 0.02 mm, 0.0008 inch. Composition: Thermally conductive fillers, Siloxane polymer matrix.
Designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules. CPU, GPU, PCB Assembly, LED Lighting, DT, NB, VGA, IPC, IC, Chipset
Solvent free formulation. Excellent Stay-ability. Thermal Stability. Good Processability. Thixotropic. High thermal conductivity. One part material. Easy application. Achieves thin Bond Line Thickness (BLT).